Search Result "thermal interface materials."
Thermal Interface Materials Based on Vertically Aligned Carbon Nanotube Arrays: A Review
Journal: Micro and Nanosystems
Volume: 11 Issue: 1 Year: 2019 Page: 3-10
Author(s): Guangjie Yuan,Haohao Li,Bo Shan,Johan Liu
Theoretical Study of the Effect of Thermal Stress on Transversal Damage of Hybrid Biocomposite Materials Flax-hemp/Polyethylene
Journal: Current Materials Science
Volume: 14 Issue: 2 Year: 2021 Page: 155-167
Author(s): Allel Mokaddem,Bendouma Doumi,Mohammed Belkheir,Ahmed Boutaous,Elhouari Temimi
Behavior of Nanocracks on Micro/Nano-Interfacial Structure Under Thermal Flux Conditions
Journal: Current Nanoscience
Volume: 5 Issue: 3 Year: 2009 Page: 335-338
Author(s): Ningbo Liao, Ping Yang, G. Q. Zhang, L. J. Ernst
Negative Thermal Expansion Materials and Their Applications: A Survey of Recent Patents
Journal: Recent Patents on Materials Science
Volume: 3 Issue: 2 Year: 2010 Page: 106-128
Author(s): Er-Jun Liang
Thermally Sprayed Thermal Barrier Coating (TBC) Systems: A Survey of Recent Patents
Journal: Recent Patents on Materials Science
Volume: 1 Issue: 2 Year: 2008 Page: 140-158
Author(s): Hans D. Lehmann, Robert B. Heimann
The Thermal Time Constant of an Electrothermal Microcantilever Resonator
Journal: Micro and Nanosystems
Volume: 15 Issue: 2 Year: 2023 Page: 102-107
Author(s):
Preparation Methods and Ceramic Materials Selection Guideline for Thermal Barrier Coatings
Journal: Recent Patents on Materials Science
Volume: 6 Issue: 2 Year: 2013 Page: 153-162
Author(s): Jiajie Hua, Wei Wu, Ziwei Liu, Yi Zeng, Hu Wang
Limiting Mechanisms of Thermal Transport in Carbon Nanotube-Based Heterogeneous Media
Journal: Recent Patents on Engineering
Volume: 5 Issue: 3 Year: 2011 Page: 209-232
Author(s): Hai M. Duong, Son T. Nguyen
Supramolecular Interactions, a Route to Control Properties and Interfaces in PLA Based Materials
Journal: Current Organic Chemistry
Volume: 21 Issue: 24 Year: 2017 Page: 2466-2478
Author(s): Marek Brzezinski,Tadeusz Biela
Structures and Materials of System-in-Package: A Review
Journal: Recent Patents on Mechanical Engineering
Volume: 14 Issue: 1 Year: 2021 Page: 28-41
Author(s): Wenchao Tian,Chuqiao Wang,Zhanghan Zhao,Hao Cui