Search Result "stencil bending"
Investigating the Influence of Uneven Printed Wiring Board Surface on Volume Increment of Deposited Solder Pastes
Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 163-169
Author(s):
CNTs - A Comparable Study of CNT-Filled Adhesives with Common Materials
Journal: Micro and Nanosystems
Volume: 2 Issue: 1 Year: 2010 Page: 15-22
Author(s): Heimann Matthias, Bjoern Boehme, Scheffler, Sebastian, Martin Wirts-Ruetters, Klaus-Juergen Wolter
Recent Developments in Wire Bonding
Journal: Recent Patents on Engineering
Volume: 1 Issue: 3 Year: 2007 Page: 238-243
Author(s): Zhao W. Zhong
Printed Organic Electronic Technology Platform Enabling the Design and Manufacturing of Integrated Circuits Towards Plastic Microprocessors
Journal: Micro and Nanosystems
Volume: 2 Issue: 1 Year: 2010 Page: 1-14
Author(s): L. G. Occhipinti, M. La Rosa, N. Malagnino, A. Marcellino, D. Nicolosi, F. Porro, G. Sicurella, R. Vecchione, V. Vinciguerra, M.V. Volpe