Abstract
This article reviews dozens of recently published patents, patent applications and journal papers for the recent developments in wire bonding for advanced microelectronics interconnections. The problems or challenges related to popular topics such as low-k devices, ultra-fine-pitch wire bonding, insulated wire bonding, low wire loops and copper wire bonding are briefly explained, and a number of new solutions to the problems and recent findings/developments are summarized.
Keywords: Microelectronics interconnections, wire bonding, low-k devices, ultra-fine pitch, copper wire, insulated wire, low wire loops
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