Search Result "Dielectric and interconnect materials"
Recent Patents on Cu/low-k Dielectrics Interconnects in Integrated Circuits
Journal: Recent Patents on Nanotechnology
Volume: 1 Issue: 3 Year: 2007 Page: 193-209
Author(s): Qing Jiang, Yong F. Zhu, Ming Zhao
Benzoxazine Based High Performance Materials with Low Dielectric Constant: A Review
Journal: Current Organic Chemistry
Volume: 23 Issue: 7 Year: 2019 Page: 809-822
Author(s): Lei Zhang,Jiale Mao,Shuang Wang,Yiting Zheng,Xiangdong Liu,Yonghong Cheng
3D Substrate/Interconnect Modeling
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010007
Reducing Crosstalk Induced Delay and Peak Noise in Carbon Nanotube Interconnects
Journal: Current Nanoscience
Volume: 14 Issue: 1 Year: 2018 Page: 76-80
Author(s): Piratla Uma Sathyakam,Partha S. Mallick
Structures and Materials of System-in-Package: A Review
Journal: Recent Patents on Mechanical Engineering
Volume: 14 Issue: 1 Year: 2021 Page: 28-41
Author(s): Wenchao Tian,Chuqiao Wang,Zhanghan Zhao,Hao Cui
Dielectric Wall Controlled Resonance Light Scattering of Coated Long Gold Nanowire
Journal: Current Nanoscience
Volume: 7 Issue: 3 Year: 2011 Page: 377-380
Author(s): Jian Zhu, Shu-min Shu-min Zhao, Jun-Wu Zhao, Jian-Jun Li
Effect of Dielectric Charging on Capacitance Change of an SOI Based CMUT
Journal: Micro and Nanosystems
Volume: 6 Issue: 1 Year: 2014 Page: 55-60
Author(s): Tugrul Zure,Sazzadur Chowdhury
Design and Analysis of L-shape Defect-based 2D Photonic Crystal Waveguide for Optical Interconnect Application With Signal Amplification
Ebook: Nanoelectronics Devices: Design, Materials, and Applications Part II
Volume: 1 Year: 2023
Author(s):
Doi: 10.2174/9789815179361123010003
Micro and Mesoporous Materials for Emerging Applications
Journal: Recent Patents on Materials Science
Volume: 3 Issue: 1 Year: 2010 Page: 57-67
Author(s): Cyrus Zamani, Soroush Nazarpour, Sara Abdollahzadeh-Ghom, Albert Cirera
Copper Metallization for Current Very Large Scale Integration
Journal: Recent Patents on Nanotechnology
Volume: 5 Issue: 2 Year: 2011 Page: 106-137
Author(s): Q. Jiang, Y. F. Zhu, M. Zhao