Search Result "microelectronic packages"


Review Article

Structures and Materials of System-in-Package: A Review

Journal: Recent Patents on Mechanical Engineering
Volume: 14 Issue: 1 Year: 2021 Page: 28-41
Author(s): Wenchao Tian,Chuqiao Wang,Zhanghan Zhao,Hao Cui

Application of Oxynitrides for Microelectronic Devices and Gas Barriers

Ebook: Metallic Oxynitride Thin Films by Reactive Sputtering and Related Deposition Methods: Process, Properties and Applications
Volume: 1 Year: 2013
Author(s): Yung-Hsien Wu,Jia-Hong Huang
Doi: 10.2174/9781608051564113010016

Recent Patents in Fluid Dispensing Processes for Electronics Packaging

Journal: Recent Patents on Mechanical Engineering
Volume: 2 Issue: 1 Year: 2009 Page: 19-25
Author(s): Minggan Li, Xiongbiao Chen

Micro Flat Heat Pipes for Microelectronics Cooling: Review

Journal: Recent Patents on Mechanical Engineering
Volume: 6 Issue: 3 Year: 2013 Page: 169-184
Author(s): Lu C. Lv,Ji Li

CNTs - A Comparable Study of CNT-Filled Adhesives with Common Materials

Journal: Micro and Nanosystems
Volume: 2 Issue: 1 Year: 2010 Page: 15-22
Author(s): Heimann Matthias, Bjoern Boehme, Scheffler, Sebastian, Martin Wirts-Ruetters, Klaus-Juergen Wolter

Concurrent Design, Modeling and Analysis of Microelectromechanical Systems Products - Design for ‘X’ Abilities

Journal: Micro and Nanosystems
Volume: 4 Issue: 1 Year: 2012 Page: 56-74
Author(s): A. Amalin Prince, Iven Jose, V. P. Agrawal

Recent Developments in Wire Bonding

Journal: Recent Patents on Engineering
Volume: 1 Issue: 3 Year: 2007 Page: 238-243
Author(s): Zhao W. Zhong

An Integrated Platform for Bio-Analysis and Drug Delivery

Journal: Current Pharmaceutical Biotechnology
Volume: 6 Issue: 1 Year: 2005 Page: 57-64
Author(s): S. Amer, W. Badawy

Getter Films for Small Vacuum Chambers

Journal: Recent Patents on Materials Science
Volume: 6 Issue: 1 Year: 2013 Page: 29-39
Author(s): Konstantin A. Chuntonov,Sergey P. Yatsenko

Recent Developments and Patents on Thin Film Technology

Journal: Recent Patents on Materials Science
Volume: 1 Issue: 3 Year: 2008 Page: 200-208
Author(s): Ioanna Giouroudi, Jurgen Kosel, Cornie Scheffer

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