Abstract
The improvement of the decoupling performance of PDN will have the highest priority for forming QSCC. The result of the feasibility study of the suitable decoupling component is presented.
Keywords: Low-impedance line structure component (LILC), QSCC, EMI, PDN, EMW, AC circuit, terminal impedance, transmission coefficient, chip ceramic LILC, multi-layers chip ceramic LILC, strip line, Pb (Zr, Ti) 03 system, loss tanδ, ceramic cylinder LILC, FPGA, solid aluminum LILC, carbon paste, conductive polymer, carbon graphite, etched aluminum film.
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