Abstract
The novel on-board decoupling component as the substitute of LILL was developed, which became actualized by the novel characteristic equations, and the all problems of LILC were solved.
Keywords: Prototype, IEC, CISPR22, EMC, on-board decoupling component, silver coating layer, cathode, anode, carbon paste layer, conductive polymer layer, etched layer, aluminum film, low impedance lossy line (LILL), conductive polymer, magnetic field distribution, transmission coefficient, terminal impedance, branch power trace, stem power trace, void.
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