Abstract
The best decoupling component was the solid aluminum LILC. The prototyping result for solving the problems which was clarified at the feasibility study is presented.
Keywords: Solid Aluminum LILC, slender chip formation, chip length, aluminum film, alumina, universal test fixture, S parameter, test jig, transmission coefficient, electromagnetic coupling, roll-roll manufacturing chip length, attenuation constant, terminal impedance, FDTD simulator, transmission characteristics, poly pyrrole (Ppy), PEDOT, TCNQ, current capability.
Related Books
Image Processing for Embedded Devices
Bipolar Transistor and MOSFET Device Models
Design of Analog Circuits through Symbolic Analysis
Electromagnetic Interference Issues in Power Electronics and Power Systems
Electromagnetics for Engineering Students Part I
Electromagnetics for Engineering Students (Part II)
Fiber Bragg Grating Sensors: Recent Advancements, Industrial Applications and Market Exploitation
Frontiers in Electrical Engineering
Modern Intelligent Instruments - Theory and Application
Photonic Bandgap Structures Novel Technological Platforms for Physical, Chemical and Biological Sensing