Abstract
EMC of PCB and ITE depends on the decoupling performance of PDN. The clarification of the relationship between the power current of LSI and the EMI of PCB became necessary.
Keywords: EMI, FR-4 board, magnetic probe, SMA connector, calibration factor, network analyzer, MP method, power current, IEC61967-6, LSI, ASIC, radiated EF strength, signal current, I/O interface, core circuit block, I/O circuit block, clock frequency, on-chip capacitor, microprocessor, capacitor cell.
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