Search Result "System in Package (SiP)"
Structures and Materials of System-in-Package: A Review
Journal: Recent Patents on Mechanical Engineering
Volume: 14 Issue: 1 Year: 2021 Page: 28-41
Author(s): Wenchao Tian,Chuqiao Wang,Zhanghan Zhao,Hao Cui
Recent Research of Electromagnetic Characteristics in Wire Bonding
Journal: Recent Patents on Mechanical Engineering
Volume: 9 Issue: 2 Year: 2016 Page: 102-111
Author(s): Wenchao Tian,Haoyue Ji
From 2D to 3D Circuits and Systems
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010003
Lab-on-Chip for Pharmacogenomics: An Embedded System Organization
Journal: Micro and Nanosystems
Volume: 1 Issue: 1 Year: 2009 Page: 30-40
Author(s): George Kornaros, Athanasios Demiris, Spyros Blionas
A Review of Micro/Nano Welding and Its Future Developments
Journal: Recent Patents on Nanotechnology
Volume: 3 Issue: 1 Year: 2009 Page: 53-60
Author(s): Kelvii W. Guo
Advances in Theoretical Studies on the Design of Single Boron Atom Compounds
Journal: Current Pharmaceutical Design
Volume: 24 Issue: 29 Year: 2018 Page: 3466-3475
Author(s): Martiniano Bello
Research and Applications of MR Elastomers
Journal: Recent Patents on Mechanical Engineering
Volume: 1 Issue: 3 Year: 2008 Page: 161-166
Author(s): Weihua Li, Xianzhou Zhang
Accessibility of Software/Hardware
Ebook: Computer Assistive Technologies for Physically and Cognitively Challenged Users
Volume: 2 Year: 2023
Author(s):
Doi: 10.2174/9789815079159123020004
Analysis of Cross-Reactivity, Specificity and the Use of Optimised ELISA for Rapid Detection of Fusarium Spp.
Ebook: Frontiers in Protein and Peptide Sciences
Volume: 2 Year: 2021
Author(s): Phetole Mangena,Phumzile Mkhize
Doi: 10.2174/9789815036663121020010
Second Part, Final Intervention for the Company HOLDERS
Ebook: Organizational Management: Case Studies for Graduate Students
Volume: 1 Year: 2015
Author(s): Claude Ziad Bayeh
Doi: 10.2174/9781681080505115010007