Abstract
Two-dimensional profile model for ion implantation at high tilt angle was derived, in order to describe the pocket ion implantation of MOSFETs. Then we can generate two-dimensional profile of ion implantation for the full MOS process neglecting diffusion of dopants, in order to predict electrical characteristic of MOSFETs.
Keywords: Ion implantation, two-dimensional profile, lateral distribution, MOSFET’s, co-implantation, flash lamp annealing, redistribution, diffusion, inverse modeling, extension, straggling, lateral straggling, reverse short channel effect, pocket ion implantation, VLSI.