Abstract
Light-emitting diodes have become very popular in general lighting due to their various advantages over other luminaires. Power consumption and LED size also play an important part in their selection over CFL’s. LEDs are compact and brighter and can be modelled according to the requirement. Due to the compact size of highpower LEDs, the temperature or heat produced by the LEDs will be more, so some efficient cooling methods must be employed. This paper compares heat dissipation through heat sinks of different sizes. This paper claims that the temperature of highpower LEDs cannot be lowered after reaching a certain point, as a result, an increase in the size of the heat sink at that particular level is useless.
Keywords: Fin Thickness, Heat Dissipation, High-Power LED (Light Emitting Diode), Heat Sink, Thermal Behavior.
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