Search Result "Wafer-handling"


Wafer-Handling Robots and Applications

Journal: Recent Patents on Engineering
Volume: 3 Issue: 3 Year: 2009 Page: 170-177
Author(s): Ming Cong, Dongmei Cui

Orally Disintegrating Systems: Innovations in Formulation and Technology

Journal: Recent Patents on Drug Delivery & Formulation
Volume: 2 Issue: 3 Year: 2008 Page: 258-274
Author(s): Honey Goel, Parshuram Rai, Vikas Rana, Ashok K. Tiwary

Review Article

Nanoscale Layer Transfer by Hydrogen Ion-Cut Processing: A Brief Review Through Recent U.S. Patents

Journal: Recent Patents on Nanotechnology
Volume: 11 Issue: 1 Year: 2017 Page: 42-49
Author(s): Benjamin T.-H. Lee

Patent Selections:

Journal: Recent Patents on Engineering
Volume: 3 Issue: 3 Year: 2009 Page: 228-230
Author(s): Bentham Science Publishers

Discovery of Novel Catalytic Materials for Emissions Control Using High Throughput Scanning Mass Spectrometry

Journal: Combinatorial Chemistry & High Throughput Screening
Volume: 10 Issue: 2 Year: 2007 Page: 135-147
Author(s): Alfred Hagemeyer, Andreas Lesik, Guido Streukens, Anthony F. Volpe, Howard W. Turner, W. Henry Weinberg, Karin Yaccato, Chris Brooks

High-Power and High-Reliability RF MEMS Switch Review

Journal: Recent Patents on Mechanical Engineering
Volume: 7 Issue: 2 Year: 2014 Page: 105-112
Author(s): Wenchao Tian,Jianglei Hu

The Process and Mechanism of Low Temperature Silicon Carbide-to-Silicon Direct Bonding Using Amorphous Hydrogenated Silicon Carbide Films

Journal: Micro and Nanosystems
Volume: 2 Issue: 2 Year: 2010 Page: 100-107
Author(s): Jiangang Du, Christian A. Zorman

Novel In-House Fabrication of Nano Lab-On-Chip Devices

Journal: Current Nanoscience
Volume: 9 Issue: 4 Year: 2013 Page: 543-551
Author(s): Tijjani Adam, U. Hashim, Th. S. Dhahi, Pei Ling Leow, Pei Song Chee

Isolation Techniques in Pediatric Dentistry

Ebook: Illustrated Pediatric Dentistry - Part 2
Volume: 1 Year: 2023
Author(s):
Doi: 10.2174/9789815080773123010011

From 2D to 3D Circuits and Systems

Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010003

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