Search Result "3D package"


Prototyping of a Reliable 3D Folded Package by Laser Micromachining

Journal: Micro and Nanosystems
Volume: 1 Issue: 2 Year: 2009 Page: 133-138
Author(s): Richard Berenyi

Polymer Composites as Packaging Materials

Ebook: Industrial Applications of Polymer Composites
Volume: 1 Year: 2023
Author(s):
Doi: 10.2174/9789815124811123010005

Review Article

Research Progress of 3D Printing Technology for PharmaceuticalPreparation

Journal: Recent Patents on Engineering
Volume: 18 Issue: 2 Year: 2024 Page: 127-139
Author(s):

Software Packages for Quantitative Microarray-Based Gene Expression Analysis

Journal: Current Pharmaceutical Biotechnology
Volume: 4 Issue: 6 Year: 2003 Page: 417-437
Author(s): I. M. Gana Dresen, J. Husing, E. Kruse, T. Boes, K.- H. Jockel

Advances and Techniques for Building 3D Agent-Based Models for Urban Systems

Ebook: Advanced Geosimulation Models
Volume: 1 Year: 2011
Author(s): Andrew T. Crooks,Andrew Hudson-Smith,Ateen Patel
Doi: 10.2174/978160805222611101010049

Modern 3D Printing Technologies: Future Trends and Developments

Journal: Recent Patents on Engineering
Volume: 9 Issue: 2 Year: 2015 Page: 91-103
Author(s): Om P. Singh,Sheikh. M. Ahmed,M Abhilash

3D Substrate/Interconnect Modeling

Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010007

Pre Placement 3D Floor planning of 3D Modules Using Vertical Constraints For 3D ICS

Ebook: Intelligent Technologies for Research and Engineering
Volume: 3 Year: 2024
Author(s): J. Zahariya Gabrie,M. Philip Austin
Doi: 10.2174/9789815196269124030014

3D-QSAR Studies on Plasmodium falciparam Proteins: A Mini-Review

Journal: Combinatorial Chemistry & High Throughput Screening
Volume: 18 Issue: 2 Year: 2015 Page: 188-198
Author(s): Selva Divakar,Sivaram Hariharan

From 2D to 3D Circuits and Systems

Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010003

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