Search Result "3D circuits"
From 2D to 3D Circuits and Systems
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010003
Nano-optics, Photonic and Quantum Circuits
Ebook: Frontiers in Nano and Micro-Device Design for Applied Nanophotonics, Biophotonics and Nanomedicine
Volume: 1 Year: 2021
Author(s): A. Guillermo Bracamonte
Doi: 10.2174/9781681088563121010011
3D Substrate/Interconnect Modeling
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010007
Symbolic Analysis Techniques for Fault Diagnosis and Automatic Design of Analog Circuits
Ebook: Design of Analog Circuits through Symbolic Analysis
Volume: 1 Year: 2012
Author(s): Francesco Grasso,Antonio Luchetta,Stefano Manetti,Maria Cristina Piccirilli,Alberto Reatti
Doi: 10.2174/978160805095611201010361
Noise and Parasites in Mixed Circuits
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010004
Research Progress of 3D Printing Technology for PharmaceuticalPreparation
Journal: Recent Patents on Engineering
Volume: 18 Issue: 2 Year: 2024 Page: 127-139
Author(s):
Prototyping of a Reliable 3D Folded Package by Laser Micromachining
Journal: Micro and Nanosystems
Volume: 1 Issue: 2 Year: 2009 Page: 133-138
Author(s): Richard Berenyi
A Micro-Channel Cooling Model for a Three-Dimensional Integrated Circuit Considering Through-Silicon Vias
Journal: Micro and Nanosystems
Volume: 13 Issue: 1 Year: 2021 Page: 49-54
Author(s): Kang-Jia Wang,Hong-Chang Sun,Kui-Zhi Wang
Modern 3D Printing Technologies: Future Trends and Developments
Journal: Recent Patents on Engineering
Volume: 9 Issue: 2 Year: 2015 Page: 91-103
Author(s): Om P. Singh,Sheikh. M. Ahmed,M Abhilash
Pre Placement 3D Floor planning of 3D Modules Using Vertical Constraints For 3D ICS
Ebook: Intelligent Technologies for Research and Engineering
Volume: 3 Year: 2024
Author(s): J. Zahariya Gabrie,M. Philip Austin
Doi: 10.2174/9789815196269124030014