Search Result "redistribution line (RDL)"
3D Substrate/Interconnect Modeling
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010007
From 2D to 3D Circuits and Systems
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010003
Recent Research of Electromagnetic Characteristics in Wire Bonding
Journal: Recent Patents on Mechanical Engineering
Volume: 9 Issue: 2 Year: 2016 Page: 102-111
Author(s): Wenchao Tian,Haoyue Ji
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