Search Result "package stacking"
Structures and Materials of System-in-Package: A Review
Journal: Recent Patents on Mechanical Engineering
Volume: 14 Issue: 1 Year: 2021 Page: 28-41
Author(s): Wenchao Tian,Chuqiao Wang,Zhanghan Zhao,Hao Cui
Polymer Composites as Packaging Materials
Ebook: Industrial Applications of Polymer Composites
Volume: 1 Year: 2023
Author(s):
Doi: 10.2174/9789815124811123010005
Prototyping of a Reliable 3D Folded Package by Laser Micromachining
Journal: Micro and Nanosystems
Volume: 1 Issue: 2 Year: 2009 Page: 133-138
Author(s): Richard Berenyi
Coconut Shell Derived Carbon Reinforced Polymer Composite Films for Packaging Applications
Ebook: Biocarbon Polymer Composites
Volume: 1 Year: 2023
Author(s):
Doi: 10.2174/9789815196689123010011
iProm-Yeast: Prediction Tool for Yeast Promoters Based on ML Stacking
Journal: Current Bioinformatics
Volume: 19 Issue: 2 Year: 2024 Page: 162-173
Author(s):
Optimizing IC Design for Manufacturability - 2011 Update
Journal: Recent Patents on Electrical & Electronic Engineering
Volume: 5 Issue: 2 Year: 2012 Page: 134-154
Author(s): Artur Balasinski
A Computational Approach to Finding RNA Tertiary Motifs in Genomic Sequences: A Case Study
Journal: Recent Patents on DNA & Gene Sequences (DIscontinued)
Volume: 7 Issue: 2 Year: 2013 Page: 115-122
Author(s): Kevin Byron, Christian Laing, Dongrong Wen, Jason T.L. Wang
GRASP55: A Multifunctional Protein
Journal: Current Protein & Peptide Science
Volume: 21 Issue: 6 Year: 2020 Page: 544-552
Author(s): Hongrong Wu,Tianjiao Li,Jianfeng Zhao
From 2D to 3D Circuits and Systems
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010003
High Power Electronic Component: Review
Journal: Recent Patents on Engineering
Volume: 2 Issue: 3 Year: 2008 Page: 174-188
Author(s): Ping H. Chen, Shyy W. Chang, Kuei F. Chiang, Ji Li