Search Result "TSV"
A Micro-Channel Cooling Model for a Three-Dimensional Integrated Circuit Considering Through-Silicon Vias
Journal: Micro and Nanosystems
Volume: 13 Issue: 1 Year: 2021 Page: 49-54
Author(s): Kang-Jia Wang,Hong-Chang Sun,Kui-Zhi Wang
From 2D to 3D Circuits and Systems
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010003
3D Substrate/Interconnect Modeling
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010007
On The Parasitic Electromagnetic Signals
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010006
Tityus serrulatus Scorpion Venom and Toxins: An Overview
Journal: Protein & Peptide Letters
Volume: 16 Issue: 8 Year: 2009 Page: 920-932
Author(s): Camila T. Cologna, Silvana Marcussi, Jose R. Giglio, Andreimar M. Soares, Eliane C. Arantes
Transconjunctival Sutureless 23-gauge Vitrectomy for Diabetic Retinopathy. Review
Journal: Current Diabetes Reviews
Volume: 5 Issue: 1 Year: 2009 Page: 63-66
Author(s): Jose G. Arumi, Anna Boixadera, Vicente Martinez-Castillo, Borja Corcostegui
Current Research Status of Microchannel Thermal Management Technology
Journal: Recent Patents on Mechanical Engineering
Volume: 8 Issue: 2 Year: 2015 Page: 120-131
Author(s): Wenchao Tian,Sanjuan Wei
Effective Routing Algorithm for Thermal Management in Vertically-Partially-Connected 3D-network on Chip
Journal: Recent Advances in Electrical & Electronic Engineering
Volume: 15 Issue: 8 Year: 2022 Page: 664-678
Author(s): Salah Eddine Bekhouche
Foreword
Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): G. Ghibaudo
Doi: 10.2174/9781608058266114010001
Engineering Resistance Against Viruses in Field Crops Using CRISPRCas9
Journal: Current Genomics
Volume: 22 Issue: 3 Year: 2021 Page: 214-231
Author(s): Vidya R. Hinge,Rahul L. Chavhan,Sandeep P. Kale,Penna Suprasanna,Ulhas S. Kadam