Search Result "Interfacial heat transfer"

A Review of Mechanical Seals Heat Transfer Augmentation Techniques

Journal: Recent Patents on Mechanical Engineering
Volume: 6 Issue: 2 Year: 2013 Page: 87-96
Author(s): Nian Xiao, Michael M. Khonsari

Recent Patents on Nanofluids (Nanoparticles in Liquids) Heat Transfer

Journal: Recent Patents on Mechanical Engineering
Volume: 1 Issue: 3 Year: 2008 Page: 190-197
Author(s): Emmanuel C. Nsofor

Behavior of Nanocracks on Micro/Nano-Interfacial Structure Under Thermal Flux Conditions

Journal: Current Nanoscience
Volume: 5 Issue: 3 Year: 2009 Page: 335-338
Author(s): Ningbo Liao, Ping Yang, G. Q. Zhang, L. J. Ernst

Modeling of Interfacial Area Transport in Two-Phase Flows

Ebook: Advances in Multiphase Flow and Heat Transfer
Volume: 4 Year: 2012
Author(s): Yang Liu,Takashi Hibiki,Mamoru Ishii
Doi: 10.2174/978160805229511204010003

Research Article

Comparison of Fluid Flow and Heat Transfer Through Metal Foams and Wire Mesh by Using CFD

Journal: Recent Patents on Mechanical Engineering
Volume: 12 Issue: 3 Year: 2019 Page: 220-226
Author(s): Banjara Kotresha,Nagarajan Gnanasekaran

Experimental and Modeling Aspects of Heat Transfer in Packed Beds

Ebook: Transport Phenomena In Particulate Systems
Volume: 1 Year: 2012
Author(s): João Cláudio Thoméo,José Teixeira Freire
Doi: 10.2174/978160805227111201010016

Current Developments in Heat Pipes: An Overview

Journal: Recent Patents on Engineering
Volume: 1 Issue: 2 Year: 2007 Page: 153-161
Author(s): R. Savino, D. Paterna, Y. Abe

Convective Boiling Heat Transfer of Pure and Mixed Refrigerants within Plain Horizontal Tubes: An Experimental Study

Ebook: Advances in Multiphase Flow and Heat Transfer
Volume: 2 Year: 2009
Author(s): Adriana Greco
Doi: 10.2174/978160805094910902010216

The Effect of Phonon and Electron on Thermal Characteristics of Cu/Al Interface

Journal: Current Nanoscience
Volume: 9 Issue: 6 Year: 2013 Page: 747-752
Author(s): Liqiang Zhang,Ping Yang,Yunqing Tang,Jie Gong,Xialong Li

Micro Flat Heat Pipes for Microelectronics Cooling: Review

Journal: Recent Patents on Mechanical Engineering
Volume: 6 Issue: 3 Year: 2013 Page: 169-184
Author(s): Lu C. Lv,Ji Li

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