Search Result "solder pads"


Investigating the Influence of Uneven Printed Wiring Board Surface on Volume Increment of Deposited Solder Pastes

Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 163-169
Author(s):

Formation and Distribution of Sn-Cu IMC in Lead-Free Soldering Process Induced by Laser Heating

Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 178-184
Author(s): Tamas Hurtony, Balint Balogh, Peter Gordon

Mapping Heat Conduction Ability of Big SMDs with Dijsktra Algorithm

Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 185-192
Author(s): Balazs Illes, Gabor Harsanyi

Illumination Optimization for Quasi-Tombstone Detection

Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 149-162
Author(s): Mihaly Janoczki, Andras Borbiro, Sandor Nagy, Laszlo Jakab

Prototyping of a Reliable 3D Folded Package by Laser Micromachining

Journal: Micro and Nanosystems
Volume: 1 Issue: 2 Year: 2009 Page: 133-138
Author(s): Richard Berenyi

Review Article

Thermal Interface Materials Based on Vertically Aligned Carbon Nanotube Arrays: A Review

Journal: Micro and Nanosystems
Volume: 11 Issue: 1 Year: 2019 Page: 3-10
Author(s): Guangjie Yuan,Haohao Li,Bo Shan,Johan Liu

Recent Developments in Wire Bonding

Journal: Recent Patents on Engineering
Volume: 1 Issue: 3 Year: 2007 Page: 238-243
Author(s): Zhao W. Zhong

Corrosion in Electronics

Ebook: Corrosion Science: Modern Trends and Applications
Volume: 1 Year: 2021
Author(s): U. Naresh,N. Suresh Kumar,K. Chandra Babu Naidu,B. Venkata Shiva Reddy,A. Manohar,M. Ajay Kumar,T. Anil Babu
Doi: 10.2174/9789811481833121010005

From 2D to 3D Circuits and Systems

Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010003

Recently Patented Facilities and Applications in Cold Spray Engineering

Journal: Recent Patents on Engineering
Volume: 1 Issue: 1 Year: 2007 Page: 35-42
Author(s): Vladimir F. Kosarev, Sergey V. Klinkov, Aleksey A. Sova

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