Search Result "Through-silicon vias"


Research Article

A Micro-Channel Cooling Model for a Three-Dimensional Integrated Circuit Considering Through-Silicon Vias

Journal: Micro and Nanosystems
Volume: 13 Issue: 1 Year: 2021 Page: 49-54
Author(s): Kang-Jia Wang,Hong-Chang Sun,Kui-Zhi Wang

Minimally Invasive Cutaneous Delivery of Macromolecules and Plasmid DNA Via Microneedles

Journal: Current Drug Delivery
Volume: 3 Issue: 1 Year: 2006 Page: 65-75
Author(s): Sion A. Coulman, David Barrow, Alexander Anstey, Chris Gateley, Anthony Morrissey, Nicolle Wilke, Chris Allender, Keith Brain, James C. Birchall

On The Parasitic Electromagnetic Signals

Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010006

From 2D to 3D Circuits and Systems

Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010003

Preparation of Stabilized Phosphorus Ylides via Multicomponent Reactions and Their Synthetic Applications

Journal: Current Organic Chemistry
Volume: 15 Issue: 2 Year: 2011 Page: 3986-4020
Author(s): Ali Ramazani, Ali Reza Kazemizadeh

Research Article

CdSe Species Decorated TiO2 Nanotubes Film Via Chemical Bath Deposition for Enhancing Photoelectrochemical Water Splitting Performance

Journal: Current Nanoscience
Volume: 14 Issue: 2 Year: 2018 Page: 148-153
Author(s): Chin Wei Lai,Kung Shiuh Lau,Nur Azimah Abd Samad,Pui May Chou

Recent Progress in High-Effective Solar Energy Conversion

Journal: Recent Patents on Electrical Engineering
Volume: 2 Issue: 2 Year: 2009 Page: 146-160
Author(s): Halyna M. Khlyap

Conductivity Enhancement by Surface Chemistry in Silicon Nanowires

Journal: Nanoscience & Nanotechnology-Asia
Volume: 1 Issue: 2 Year: 2011 Page: 177-182
Author(s): Rui-Qin Zhang, Kun-Peng Dou, Abir De Sarkar

3D Substrate/Interconnect Modeling

Ebook: Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Volume: 1 Year: 2014
Author(s): Christian Gontrand
Doi: 10.2174/9781608058266114010007

Synthesis of Unsaturated Organosilicon Compounds Via Alkene Metathesis and Metathesis Polymerization

Journal: Current Organic Chemistry
Volume: 7 Issue: 8 Year: 2003 Page: 691-735
Author(s): Bogdan Marciniec, Cezary Pietraszuk

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