Search Result "solder joint reliability"
Formation and Distribution of Sn-Cu IMC in Lead-Free Soldering Process Induced by Laser Heating
Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 178-184
Author(s): Tamas Hurtony, Balint Balogh, Peter Gordon
Experimental Investigation of Microstructural Effects in Sn-Pb Solder Accumulated During Ten Years of Service Life
Journal: Micro and Nanosystems
Volume: 13 Issue: 2 Year: 2021 Page: 170-179
Author(s): Marek Werner,Kerstin Weinberg
Illumination Optimization for Quasi-Tombstone Detection
Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 149-162
Author(s): Mihaly Janoczki, Andras Borbiro, Sandor Nagy, Laszlo Jakab
A Review of Developments in Au-Sn Eutectic Alloy Electrodeposition
Journal: Innovations in Corrosion and Materials Science (Discontinued)
Volume: 8 Issue: 1 Year: 2018 Page: 3-23
Author(s): O.N. Vrublevskaya
Thermal Interface Materials Based on Vertically Aligned Carbon Nanotube Arrays: A Review
Journal: Micro and Nanosystems
Volume: 11 Issue: 1 Year: 2019 Page: 3-10
Author(s): Guangjie Yuan,Haohao Li,Bo Shan,Johan Liu
Current Concepts in Meniscus Tissue Engineering
Journal: Current Rheumatology Reviews
Volume: 4 Issue: 3 Year: 2008 Page: 196-201
Author(s): Anja Drengk, Klaus Michael Sturmer, Karl-Heinz Frosch
Metallic Electrodes; Restrictions and Future Prospective; A Survey on Recent Patents
Journal: Recent Patents on Materials Science
Volume: 3 Issue: 2 Year: 2010 Page: 178-188
Author(s): Soroush Nazarpour, Cyrus Zamani , Albert Cirera
Meet our Editorial Board Member
Journal: Current Mechanics and Advanced Materials
Volume: 1 Issue: 2 Year: 2021 Page: 1-1
Author(s):
CNTs - A Comparable Study of CNT-Filled Adhesives with Common Materials
Journal: Micro and Nanosystems
Volume: 2 Issue: 1 Year: 2010 Page: 15-22
Author(s): Heimann Matthias, Bjoern Boehme, Scheffler, Sebastian, Martin Wirts-Ruetters, Klaus-Juergen Wolter
Corrosion in Electronics
Ebook: Corrosion Science: Modern Trends and Applications
Volume: 1 Year: 2021
Author(s): U. Naresh,N. Suresh Kumar,K. Chandra Babu Naidu,B. Venkata Shiva Reddy,A. Manohar,M. Ajay Kumar,T. Anil Babu
Doi: 10.2174/9789811481833121010005